Process Capability
ProjectTechnical parameterSpecial process
Layers

1-18

High Tg Fr4

Warpage

Double side multi-layers d≤0.075%

High Tg Fr4

Characteristic Impedance Error

±10%

D≤0.05

External Dimension Tolerance

±0.1mm

±5%

Surface Treatment Technology

Gold finger: ≥0.13μm

Immersion Gold: 0.025-0.075μm OSP: 0.2~0.5μm

Tin spray (HALI): 5~20μm

Lead-free spray tin (LEADFREE HAL): 5~20μm

Gold plating (Stride): 0.025-3.0μm


±0.05mm

Minimum Line Width And Line Spacing

0.075mm / 0.075mm

≥1.0μm

Minimum Aperture

0.2mm (10:1 aspect ratio)

Substrate

FR-4, aluminum base, Aluminium

Metallized Aperture Tolerance

D>5.0  ±0.076mm 0.3D≤0.3 ±0.08mm

Maximum Processing Size

635*1120mm

hole wall copper thickness

≥20μm

Plate Thickness

0.2-3.2mm

CNC type

Milling, punch, V-cut, bevel

Surface Coating

Solder mask: black, green, white, red, thickness≥17μm, plug hole, BGA

Text: Black, Yellow, Green, White, Font: Character height min. 0.625mm, line width min. 0.125mm

Carbon film: black, thickness≥25μm, minimum line width 0.33mm, minimum line spacing 0.30mm

Blue glue: red, blue, thickness≥300μm